Inline inner layer developing, etching and dry film stripping, process controlled to ensure the quality of thin (.002”) cores with fine (.0025”) lines and (.0025”) spaces.

Check material migration during lamination cycle and ensure greatly improved registration during the subsequent drilling process.

Timax Drilling machine can drill min. hole of 0.15mm.

Parallel light dispersion, far superior to conventional light dispersion, allows better dry film adhesion and cleaner walls for more accurate etching of traces down to .0025”.

High quality surface treatment prior to soldermask ensures better adhesion and reduced peeling after assembly.

100% inspection of all inner layers to guarantee higher yields and lower scrap rates, translating to lower prices.

Pre-processing before lamination.

Meet the needs of all kinds of multilayer boards and mixed dielectric build-up.

Machine tolerance+/-.002”, board thickness .010”-.125”.

The most advanced Surpass Tester(X600L) can test tracks/space of 3mil/3mil.